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    HDI PCB (M-VIA Ⅰ/Ⅱ)

    These are multi-layer PCBs in which layers are piled up one by one using laser technology and plating technology after forming a conductor pattern on an insulating layer. Because wiring is possible on the connection part of each layer, this method achieves higher density and higher integration than ordinary multi-layer through-hole PCBs. They are used for devices that require high-density wiring in a limited space.
     

    Features

    • HDI PCBs with Staggered Via and Stacked Via
    • Any combination with Laser Via, IVH or Plated Through Hole is possible
     

    Cross section

    M-VIA I (Staggered Via) M-VIA II (Stack Via)
     

    Stackup

    M-VIA I (Staggered Via) M-VIA II (Stack Via)
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