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    AnyLayer PCB

    These are PCBs that enable free connection between all layers combining laser technology and filled plating technology that allows ultra-fine processing. With the higher degree of design freedom and higher-density wiring, these PCBs are ideal for the needs of downsizing and thinning of smartphones and other high performance devices.
     

    Features

    • AnyLayer PCBs with Laser Via and Filled Plating on each layer
    • Thinner 0.4mm pitch CSP by AnyLayer interconnection supported
    • Mass-production of 10-layer M-VIA Ⅲ (AnyLayer PCBs) for mobile devices
     
    Cross section Stackup
    AnyLayer PCB (M-VIA Ⅲ) 10-layer M-VIA Ⅲ
     
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